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Sputtering
Targets |
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Ti
Target (99.99%)
8"
dia x 5mm thick
Bonded
to Cu Plate
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Purity up to 99.999% |
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Target sizes from 1” dia. to 8” dia. |
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Thickness from 1/8” to 1/4" |
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High quality at lower prices |
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OFHC backing plates |
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Target bonding (solder/epoxy/diffusion) |
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Analysis provided |
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Please inquire for details of items
not listed or shown here.
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Stock Sale |
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1 |
Silicon (Si) Target, Undoped,
99.999%
2"
dia x 1/8" thick |
2 |
$
180/ea |
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2 |
Silicon Dioxide (SiO2) Target,
99.9%
3"
dia x 1/8" thick |
1 |
$ |
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3 |
Nickel (Ni) Target, 99.99%
3"
dia x 1/8" thick |
1 |
$ |
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4 |
Sputtering
Target, 99.99%
Tin Oxide (SnO2)
2" dia x 0.125"
thick
Complete with
bonding to a Cu plate of
2" dia x 0.125"
thick |
1 |
$
595/- |
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5 |
Sputtering
Target, 99.99%
Titanium Oxide
(TiO2)
2" dia x 0.125"
thick
Complete with
bonding to a Cu plate of
2" dia x 0.125"
thick |
1 |
$
585/- |
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6 |
Sputtering Target
Sheet, 99.99%
Tin (Sn)
2" x 2” x 2mm
Thick |
1 |
$
180/- |
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7 |
Sputtering Target
Sheet, 99.99%
Titanium (Ti)
2" x 2” x 2mm
Thick |
1 |
$
199/- |
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8 |
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1 |
$ |
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Copyright
2003-2011 VIN KAROLA INSTRUMENTS. All rights reserved.
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Please
enquire
about our
Gold
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Platinum
Silver
and
Boron
Targets
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-BondedCuPlate.JPG)
ZnO + 2%Ag
Target, 99.99%
400mm x
100mm x 3mm
Bonded to
Cu Plate
Gold
Target
99.99%
3"
dia x 1/8" Thick
Bonded
to Cu Plate
Silver
Target
99.99%
4" dia
x 6mm Thick
Diffusion Bonded
to Cu Plate
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